Leading with Technology and Manufacturing Muscle
Part of Numonyx’ strength is built on its ability to develop and deliver cutting-edge technologies and advanced manufacturing capabilities – the building blocks for leading non-volatile memory products. The company is currently producing high volume 65nm NOR memory chips and plans to quickly move to 45nm before the end of the year, enabling state-of-the-art technology at lower cost. In addition, Numonyx possesses some of the most sophisticated packaging and stacking techniques in the industry to enable more flexible and space-saving configurations for customers.
To meet demand for Numonyx memory chips, the company will possess both wafer fabrication and assembly and test manufacturing facilities in addition to holding external supply agreements. These facilities include six 200 mm and three 300 mm wafer fabs, including Numonyx owned facilities in Israel, Italy and Singapore. This will give Numonyx the flexibility to produce any combination of NOR, NAND and RAM wafers depending on customer demand.
A Distinguished History, A Promising Future
With 40 years of combined experience from Intel and STMicroelectronics, Numonyx is receiving a substanial worldwide patent portfolio from Intel and STMicroelectronics. The patents and applications cover a variety of technologies including flash memory and PCM, graphics, cell phones, storage media, processors, semiconductor manufacturing and packaging, and various consumer devices. Numonyx also brings a history of breakthroughs and milestones including seven generations of Multi-level Cell (MLC) technologies. “Our broad portfolio of intellectual property, patents and expertise will serve as the cornerstone for Numonyx,” continued Harrison. “We intend to build on this rich history with even more innovation.”
For example, earlier this month Intel and STMicroelectronics announced that the industry’s first functional prototypes (code named “Alverstone”) of a future product using PCM was being sampled to customers. The parent companies also presented a research paper describing how they created the world’s first demonstrable high-density, MLC large memory device using PCM technology. PCM is a promising new memory technology that provides very fast read and write speeds at lower power than conventional flash, and allows for bit alterability normally seen in RAM.
The Numonyx executive team is comprised of seasoned industry veterans from both Intel and STMicroelectronics as well as other industry executives. Brian L. Harrison, formerly vice president and general manager of the Flash Memory Group for Intel has been appointed chief executive officer and Mario Licciardello, corporate vice president and general manager of STMicroelectronics’ Flash Memories Group has been appointed chief operating officer.
Headquartered in Switzerland and incorporated in the Netherlands, Numonyx has approximately 7,000 employees worldwide with facilities in USA, Italy, China, Israel, Singapore, Malaysia, and Philippines. Bank financing for the new venture is being provided by Intesa Sanpaolo s.p.a and Unicredit Banca d'Impresa s.p.a.
Numonyx designs and manufactures a full complement of integrated NOR, NAND and Phase Change non-volatile memory technologies and products to meet the increasingly sophisticated needs of customers in the cellular and embedded markets. Numonyx combines the technology and manufacturing expertise of the flash memory divisions of Intel Corporation and STMicroelectronics, and is dedicated to providing high density, low power memory technologies and packaging solutions to a global base of customers. Additional information about Numonyx is available at www.numonyx.com