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Micron Announces Expansion of its e•MMC Portfolio
JEDEC-compliant 4.41 solution combines high-capacity NAND Flash with an MMC controller to simplify hardware and software design
BOISE, Idaho, July 24, 2012 - Micron Technology, Inc. (Nasdaq: MU), one of the world's leading providers of advanced semiconductor solutions, today announced the expansion of Micron's e•MMC (embedded multimedia card) family of products with devices from 2GB to 64GB enabling solutions for the embedded market. The 4.41 solution offers quick system integration and is suitable for both standard and full industrial temperature environments in a wide range of applications such as digital TV, DVD, set-top box, industrial, medical, imaging, routers, and servers, to name a few.
Micron's e•MMC embedded memory combines a high-capacity NAND Flash memory device with a multimedia card controller in a single BGA package. The single-package solution is a great choice for designers who are looking for a fully managed solution to easily integrate into their application. Because Micron manufactures the NAND, the company can offer e•MMC solutions in a variety of densities and options tailoring performance and features to meet the unique needs of embedded applications. In addition, Micron's e•MMC 4.41 compatible-devices are fully compliant with JEDEC industry standards.
"Micron boasts a dedicated organization that is solely focused on embedded customer needs and requirements," said Jeff Bader, vice president of Marketing for the Embedded Solutions Group at Micron. "Adoption of e•MMC is growing in the embedded market; with the introduction of Micron's e•MMC family of products we will greatly enhance our customers' ability to meet today's design requirements quickly and effectively."
What the Industry is Saying
"With the 4.41 revision satisfying the performance and security needs of most device segments, it is considered the most effective way to utilize high-density NAND for many consumer electronics applications, including entry-level smartphones, ereaders, TVs, set-top boxes and portable music players." (Ryan Chien, IHS iSupply, 'e.MMC NAND Flash Memory Remains Viable Despite UFS Entry,' March 28, 2012)
Micron's embedded e•MMC family includes several unique features optimized for the varied needs of embedded and industrial applications. In addition to current JEDEC solutions with 0.5mm ball pitch, Micron offers a 100-ball 1mm ball pitch optimized for low-cost, high reliability board design and manufacturing. Availability of industrial temperature range (-40C to +85C), SLC partitioning, and power loss data protection capability provide a compelling solution for reliable code and data storage needs in embedded systems.
Micron e•MMC Key Features and Benefits
- Adheres to the JEDEC standard, easing the design and validation process
- Offers standard operating and I/O voltages 3.3Vcc (3.3V/1.8 Vccq)
- Provides a wide density range of 2GB-64GB
- Offers standard and extended temperature ranges of -25°C to +85°C and -40C to +85C which is ideal for rugged environments and industrial applications
- Available in 100-Ball 1mm pitch and JEDEC153-Ball, 169-Ball BGA 0.5 mm pitch packages
- Integrated NAND controller removes the burden of managing the NAND from the host controller, compared to a discrete NAND device
- Enhanced features enabled in partitions and user data area (pseudo SLC partitions) provide reliability for code and system data
- Shipped with optimized write performance, customer configurable for advanced data protection against power loss.
Micron's e•MMC 4.41 compatible-devices are sampling now with production scheduled in September 2012.
For more information visit: http://www.micron.com/products/managed-nand/e-mmc
Micron Technology, Inc. is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc. visit www.micron.com.
The Micron Technology, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=6950
©2012 Micron Technology, Inc. All rights reserved. Information is subject to change without notice. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. e•MMC is a registered trademark of MultiMediaCard Association. All other trademarks are the property of their respective owners. This news release contains forward-looking statements regarding the production of e•MMC. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.
Mary Ellen Ynes